Artifact Evaluation Submissions

RTSS 2026 Artifact Evaluation

Artifact Evaluation (AE) for RTSS is an optional evaluation process for research works that have been accepted for publication at RTSS. Authors are encouraged to submit artifacts to increase the value and the visibility of their research.

The AE process seeks to further the goal of reproducible science. It offers authors the opportunity to highlight the reproducibility of their results, and to obtain a validation given by the community for the experiments and data reported in their paper. In the AE process, peer practitioners from the community will follow the instructions included in the artifacts and give feedback to the authors, while keeping papers and artifacts confidential and under the control of the authors.

The AE process is non-competitive and success-oriented. The acceptance of the papers has already been decided before the AE process starts and the hope is that all submitted artifacts will pass the evaluation criteria. Authors of artifacts are expected to interact with the evaluators to fix any possible technical issues that may emerge during the review process and to improve the portability of the artifact.

Authors of papers corresponding to artifacts that pass the evaluation will be entitled to include, in the camera-ready version of their paper, an RTSS AE seal that indicates that the artifact has passed the repeatability test. Authors are also entitled to, and indeed encouraged, to also use this RTSS AE seal on the title slide of the corresponding presentation at RTSS 2026.

Please refer to the Artifact Evaluation Criteria for further details on how artifacts are evaluated.

Organizers

Artifact Evaluation Chair
Federico Aromolo
Scuola Superiore Sant’Anna, Pisa, Italy

Evaluation Committee

• Sunandan Adhikary, Indian Institute of Technology Kharagpur, India
• Shareef Ahmed, University of South Florida, USA
• Abdullah Al Arafat, Florida International University, USA
• Jatin Arora, VORTEX CoLab, Portugal
• Hyunjong Choi, San Diego State University, USA
• Hoon Sung Chwa, DGIST, South Korea
• Cédric Courtaud, Scaleway, France
• Max Deppert, Kiel University, Germany
• Anaïs Finzi, TTTech Computertechnik AG, Austria
• Nils Hölscher, TU Dortmund, Germany
• BaekGyu Kim, DGIST, South Korea
• Jaeheon Kwak, Ajou University, South Korea
• Ann Franchesca Laguna, Laguna De La Salle University, Philippines
• Ruoxiang Li, City University of Hong Kong, China
• Yehan Ma, Shanghai Jiao Tong University, China
• Alfonso Mascareñas González, ONERA, France
• Filippo Muzzini, Università di Modena e Reggio Emilia, Italy
• Catherine Nemitz, Davidson College, USA
• Sangeun Oh, Korea University, South Korea
• Sims Osborne, Elon University, USA
• Luigi Pannocchi, Scuola Superiore Sant’Anna, Pisa, Italy
• Yuxin Ren, Huawei Technologies, China
• Harun Teper, TU Dortmund University, Germany
• Corey Tessler, University of Nevada, Las Vegas, USA
• Sergi Vilardell, Barcelona Supercomputing Center, Spain
• Yidi Wang, Santa Clara University, USA
• Shuai Zhao, Sun Yat-sen University, China
• Raffaele Zippo, University of Pisa, Italy

Submission Deadline

Artifacts for accepted papers and conditionally accepted papers undergoing shepherding are expected to be submitted by August 21, 2026.

Artifact Submission

Please refer to the Artifact Preparation Instructions for guidelines and best practices for packaging your artifact to ensure evaluation success.

Please submit your artifact via the following link: https://rtss2026ae.hotcrp.com/.